JIS C6489-1994 印制电路板镀铜膜叠层板(玻璃纤维无纺织物复合基环氧树脂)

上一篇: JIS X0503-1994 条码符号.NW7和39码.基本规范
下一篇: JIS C6493-1994 印制电路用基材.第2部分:规范.第17号规范.制造多层印制板用的规定可燃性能的薄聚酰亚胺玻璃纤维织物覆铜箔叠层板

Product Code:SAE AMS2404
Title:Plating, Electroless Nickel
Issuing Committee:Ams B Finishes Processes And Fluids Committee
Scope:This specification covers the requirements for electroless nickel deposited on various materials.This deposit has been used typically to provide a uniform build-up on intricate shapes, to improve wear and/or corrosion resistance, or to improve solderability on or for selected materials, but usage is not limited to such applications. The deposit has been used in service up to 1000 掳F (540 掳C) although wear and/or corrosion resistance may degrade as service temperature increases.